Please answer the following questions:

Give an example of a thin film coating. How is it deposited and what is the application?

Calculate the mean free paths for pressures of

(a) 10-5 Torr and

(b) 102 Torr.

(c)Based on the previous calculation, which pressure would be more suitable for PVD rather than CVD processes and why?

What is the Debye shield length in plasmas?

What is a plasma sheath? Where and why does it form?

Describe ion surface interactions as a function of ion energy.

Name one advantage for each of the following PVD techniques: (a) electron beam evaporation deposition, (b) sputter depositions, (c) vacuum arc evaporation deposition.

What is reactive magnetron sputter deposition? What type of films can be deposited with this method?

Which process parameter is driving the deposition rate in (a) vacuum vapor deposition, (b) sputter deposition and (c) cathodic arc deposition?

Briefly describe three characteristics of cathode spots in cathodic vacuum arc discharges.

The following curve shows the breakdown voltage versus gas pressure for a given gap distance of two electrodes. This curve has an optimal pressure at which the breakdown voltage is minimal, i.e., the curve has a minimum. Explain why the breakdown voltage increases (a) at lower pressures and (b) at pressures with respect to this minimum.